this post was submitted on 08 Jul 2025
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LG Innotek to slim down smartphones by replacing solder balls with copper posts (www.tomshardware.com)
submitted 5 days ago by [email protected] to c/[email protected]
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[–] [email protected] 12 points 5 days ago* (last edited 5 days ago) (1 children)

"LG proposes eliminating solder balls"

"By instead using copper, with solder balls on top"

What?

[–] [email protected] 7 points 4 days ago (1 children)

The article is utter garbage and misunderstands dimensions.

The new strategy allows for pads to be closer together not for the whole thing to be flatter. It allows to shrink sideways, not in height.

[–] [email protected] 1 points 3 days ago (1 children)

My phone is thinner sideways than most, and it's often a problem when browsing websites that make assumptions about screen dimensions.

[–] [email protected] 1 points 2 days ago

Again, it's about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.